SUSS MicroTec SE

Equipment used to process wafers and assemble advanced semiconductor packages.

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SUSS MicroTec SE, based in Garching near Munich, makes machines used in semiconductor production. Its role becomes especially interesting when several chips need to work together inside one package. Making the chips smaller is only part of the job; putting them together is an engineering problem of its own.

Customers buy equipment for steps such as coating wafers, exposing patterns and temporarily bonding wafers during processing. SUSS also supplies photomask-cleaning equipment. These machines serve chipmakers, foundries and packaging specialists, supported by installation, spare parts and service.

Latest results

Jan–Jun 2026

Revenue
€202.8 millionDecreased · vs Jan–Jun 202524% lower · vs Jan–Jun 2025
Operating profit
€14.2 millionDecreased · vs Jan–Jun 202567.9% lower · vs Jan–Jun 2025

€0.07 operating profit per €1 of sales

Cash held
€112.3 millionAt Jun 30, 2026
Financial debt
At Jun 30, 2026
Source: company financial report

Latest company update

Aug 6, 2026 · Issuer publication

SUSS MicroTec SE · H1 2026 financial report

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