Unternehmensmeldung18. Sept. 2026ENSoitec announces the success of its offering of bonds settled in cash and/or convertible into new shares and/or exchangeable for existing shares (“ORNANEs”) due September 2033 for a nominal amount of €500 millionSoitec SACompany newsroom
Unternehmensmeldung17. Sept. 2026ENSoitec launches an offering of bonds settled in cash and/or convertible into new shares and/or exchangeable for existing shares (“ORNANES”) due September 2033 for a nominal amount of €500 millionSoitec SACompany newsroom
Unternehmensmeldung29. Juli 2026ENSoitec held its 2026 Annual General MeetingSoitec SACompany newsroom
Unternehmensmeldung28. Juli 2026ENSoitec and the French tax authorities agree on the main terms of a settlementSoitec SACompany newsroom
Unternehmensmeldung22. Juli 2026ENSoitec reports first quarter revenue of fiscal year 2027Soitec SACompany newsroom
Unternehmensmeldung1. Juli 2026ENCombined general meeting of July 29, 2026 : Conditions for obtaining the preparatory documentsSoitec SACompany newsroom
Unternehmensmeldung29. Juni 2026ENSoitec and ZenSemi Partner to Scale 300mm BCD-on-SOI Production for Next-Generation Power ElectronicsSoitec SACompany newsroom
Unternehmensmeldung10. Juni 2026ENAvailability of the 2025-2026 Universal Registration DocumentSoitec SACompany newsroom
Unternehmensmeldung27. Mai 2026ENSoitec reports fiscal 2026 full-year resultsSoitec SACompany newsroom
Unternehmensmeldung13. März 2026ENSoitec and NSIG to agree extension of licensing frameworkSoitec SACompany newsroom
Unternehmensmeldung5. März 2026ENSoitec Secures Multi-Year Agreement to Supply POI Wafers for Skyworks’ Sky5 PlatformSoitec SACompany newsroom